In Stock:
767
Pricing
QTY | UNIT PRICE | EXT PRICE |
---|---|---|
1 | 633.6 | |
10 | 620.928 | |
100 | 601.92 | |
1000 | 582.912 | |
10000 | 557.568 |
Products Specifications
Length | 27mm |
---|---|
Series | Zynq®-7000 |
HTS Code | 8542.39.00.01 |
RAM Size | 256KB |
ECCN Code | 3A991.D |
Frequency | 667MHz |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Packaging | Tray |
Published | 2009 |
Technology | CMOS |
Memory Type | ROMless |
Part Status | Active |
Peripherals | DMA |
RAM (words) | 256000 |
RoHS Status | ROHS3 Compliant |
Speed Grade | -1 |
Architecture | MCU, FPGA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Boundary Scan | YES |
JESD-609 Code | e1 |
Number of I/O | 130 |
Surface Mount | YES |
Terminal Form | BALL |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Data Bus Width | 32b |
Number of Pins | 676 |
Package / Case | 676-BBGA, FCBGA |
Supply Voltage | 1V |
Terminal Pitch | 1mm |
Contact Plating | Copper, Silver, Tin |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Base Part Number | XC7Z045 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Core Architecture | ARM |
Factory Lead Time | 10 Weeks |
Terminal Position | BOTTOM |
Max Supply Voltage | 3.3V |
Min Supply Voltage | 1.2V |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Height Seated (Max) | 2.54mm |
Radiation Hardening | No |
Operating Temperature | 0°C~85°C TJ |
Number of Terminations | 676 |
Peak Reflow Temperature (Cel) | 245 |
Number of Logic Elements/Cells | 190000 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |