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10334
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Products Specifications
| Speed | 667MHz |
|---|---|
| Series | Zynq®-7000 |
| HTS Code | 8542.39.00.01 |
| RAM Size | 256KB |
| Packaging | Tray |
| Technology | CMOS |
| Part Status | Active |
| Peripherals | DMA |
| RAM (words) | 256000 |
| RoHS Status | Non-RoHS Compliant |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| JESD-30 Code | S-PBGA-B676 |
| Boundary Scan | YES |
| Number of I/O | 4 |
| Surface Mount | YES |
| Terminal Form | BALL |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | 676-BBGA, FCBGA |
| Clock Frequency | 667MHz |
| Bus Compatibility | CAN, ETHERNET, I2C, PCI, SPI, UART, USB |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Additional Feature | GPIO WITH FOUR 32-BIT BANKS |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C~100°C TJ |
| Number of Terminations | 676 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
